Current and future uses of high density neural implant arrays for functional electrical stimulation systems

A successful implant used for FES and sensor systems that support FES depends on the confluence of device fabrication technology, biomaterials electronics packaging and signal conditioning and processing. Over many years, we have been building a technology that embodies as much of this function into a system that is batch processed using silicon technology in much the same way a computer or communications chip is fabricated [1]. The icon for such a device is shown in Figure 1a. Much can be designed into the core silicon device such as functional form, efficient sensing and charge delivery electrochemistry [2-4], silicon cables [5], fluid delivery channels [6], electronics, pacification against the hostile environment of the body and signal routing. A key factor to the utility of such a system is the precision of the recording and stimulation sites.